3M 583 Heat activated double-sided nitrile phenolic adhesive tape

      3M 583 heat activated adhesive film for printed circuit boards

3M 583 is a reactivatable heat-curing adhesive film made from nitrile phenolic resin, engineered for high bond strength across a wide range of materials.

Its flexibility, thin profile, and ability to be custom die-cut make it ideal for electronics, automotive, aerospace, and signage applications.

3M 583 is delivered as a thin, slightly tacky film, allowing for easy pre-positioning before bonding. To achieve full adhesive strength, it must be activated by:

• Heat, between 107°C and 149°C under pressure

• Or appropriate solvents for temperature-sensitive assemblies

After bonding, the film can be crosslinked to enhance its thermal and chemical resistance. This is done by heating the bonded assembly at 177°C for 8 minutes or 110°C for 4 to 15 hours.

Key benefits of 3M 583

• High-performance thermosetting adhesive film

• Activates with heat or solvents

• Flexible and easily die-cut

• Withstands high temperatures after curing

• Strong adhesion to metals, plastics, and fabrics

• Suitable for structural bonding in demanding environments

      Typical applications of 3M 583

• Electronic component assembly

• Splicing glass fabrics in PCB manufacturing

• Bonding technical films or foils

• Electrical insulation in devices

• Industrial laminations requiring precision and strength

• Composite part fabrication

      Why choose 3M 583?

✔ Versatile: Compatible with multiple substrates and activation methods

✔ Durable: Resists mechanical and thermal stress

✔ Precise: Thin film for high-accuracy applications

✔ Flexible: Conforms to complex shapes without tearing

✔ Reliable: Long-lasting adhesion even under extreme conditions

      Technical data – 3M 583 bonding tape